Shenzhen International Electronic Components and Materials Procurement Exhibition (ES SHOW)
Edit： Click： Times Date：2025-9-4
Shenzhen International Electronic Components and Materials Procurement Exhibition (ES SHOW)
Exhibition time: November 06-08, 2024
Exhibition Location: Shenzhen International Convention and Exhibition Center (Bao'an)
Organizational structure: Shenzhen Electronic Chamber of Commerce, Reed Exhibition Group, Yihuiyuan Exhibition (Shenzhen) Co., Ltd
Exhibition Overview:
The Shenzhen International Electronic Components and Materials Procurement Exhibition (ES SHOW) is jointly organized by the Shenzhen Electronic Chamber of Commerce, Reed Exhibitions Group, and Yihuiyuan Exhibition (Shenzhen) Co., Ltd. It is a professional exhibition that focuses on showcasing various semiconductors/ICs, active chips, and discrete devices required for electronic product design and production. It is a procurement platform for the electronic components and materials industry that provides technical exchanges for enterprises from the electronic technology application field.
ES SHOW 2024 will be held concurrently with NEPCON ASIA Asia Electronic Production Equipment Exhibition, AWC Shenzhen International New Energy and Intelligent Connected Vehicle Exhibition, C-TOUCH Shenzhen International Full Touch and Display Exhibition, and S-FACTORY EXPO Intelligent Factory and Automation Technology Exhibition, jointly showcasing electronic components+intelligent connected vehicles+PCBA process+intelligent factory and other comprehensive electronic and manufacturing industry chain products and technical solutions. At that time, the five exhibitions will be combined to present a 160000 square meter exhibition of the entire electronic and electronic manufacturing industry chain, with over 3000 companies participating and attracting more than 100000 professional visitors.
Exhibition highlights:
Ø ESSHOW+AWC, showcasing comprehensive automotive front-end technology and application solutions
MCU、 Semiconductor application technologies for future high computing power, high energy efficiency assisted driving, electric/hybrid power systems, such as storage chips (DRAM, NAND, NOR, etc.), SoC chips, CIS, IGBT, SiC, ADAS, BMS, ECU technology, automotive manufacturing technology, intelligent vehicle technology, new energy vehicle technology, etc;
Ø ESSSHOW+NEPCON, full industry chain technology and solutions from chips to PCBA
New domestic and international equipment products and advanced technology solutions related to semiconductor/IC, active/passive devices, SIP technology, PCBA process, EMS services, semiconductor packaging and testing technology, electronic manufacturing technology, surface mount technology, welding technology, dispensing and spraying technology, testing and measurement technology, touch screen and display technology, electronic materials, etc.
Ø ESSSHOW+C-TOUCH, full industry chain technology from chips to displays
New products and advanced technology solutions related to power ICs, driver ICs, Mini/Micro LEDs, touch modules, core processes, touch screens and display technologies, electronic materials, and other related industries in the display industry both domestically and internationally.
Our company's display scope:
Automatic printing and labeling machine
Printing consumables
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